Samsung Electronics will showcase AI semiconductor products and solutions ranging from HBM4E high-performance memory to advanced packaging technologies at the 2026 Korea Semiconductor Show held in Seoul from October 14 to 16, while also unveiling the construction plan for the Yongin National Industrial Complex to address growing global AI infrastructure demand.
This year's exhibition is themed "Building AI Systems" and features six zones: Next-Generation Technology, Cloud AI, Edge AI, Physical AI, Semiconductor Industry Cluster, and Win-Win Cooperation. Notably, Samsung has added a Semiconductor Industry Cluster zone for the first time, introducing its existing production and R&D bases, as well as the planned Yongin National Industrial Complex.
Samsung Plans to Launch First Production Line at Yongin National Industrial Complex in 2029
Samsung plans to invest approximately 360 trillion won in the Yongin National Industrial Complex, with site preparation and construction slated to begin in 2027, targeting the launch of the first production line in October 2029. The complex is expected to attract around 70 materials, parts, equipment, and chip design companies, forming a semiconductor industry ecosystem covering manufacturing, R&D, and supply chain collaboration.
On the product front, Samsung will showcase HBM4E for AI applications, as well as LPDDR-PIM with integrated compute functions inside memory. Exhibits also include the zHBM model based on 3D memory architecture to shorten the physical distance between compute units and memory, and the zNAND-O model, a 3D NAND solution optimized for edge AI.
The foundry business will exhibit HBM4E base dies using 4-nanometer process technology, 2.3D Cube-E extended high-density packaging technology based on silicon bridges, and 3D Cube-H three-dimensional packaging technology. At the same time, Samsung will also showcase a CPO optical interconnect model that transmits data through electrical-to-optical signal conversion.
The System LSI business exhibits include DIMM solutions for ensuring stable operation of server memory modules, the 200-megapixel ISOCELL HPC image sensor, and the Exynos 2600 mobile processor.
Item Specification Processor Exynos 2600 Camera Pixels 200 Megapixels
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