On October 13, Samsung Electronics announced that the company participated in the "OCP Global Summit 2026" held in San Jose, California, USA on the 12th local time, unveiling an AI infrastructure innovation strategy covering next-generation high-bandwidth memory (HBM), memory expansion technology, and storage solutions. Samsung also jointly demonstrated next-generation memory expansion technology with U.S. Advanced Micro Devices (AMD), and showcased collaboration achievements with global AI companies such as Nvidia, indicating it is expanding the scope of technology cooperation from mere memory supply to the overall AI system.
Samsung Electronics Showcases Multiple Technology Innovations at OCP Global Summit
At this year's OCP Global Summit, Samsung Electronics unveiled three technology directions: first, high-performance memory including HBM5 and customized HBM; second, memory expansion technology based on Compute Express Link (CXL); third, data storage and management technology utilizing next-generation solid-state drives (SSD). At the same time, Samsung jointly demonstrated a CXL-based memory expansion solution with AMD, and displayed the Groq LPU wafer and Nvidia Groq 3 LPX system, among others, introducing collaboration achievements with global AI companies.
Shim Ho-jun, executive vice president of the AE Team in the Memory Business Division of Samsung Electronics' Semiconductor (DS) Division, emphasized in a speech that day: "As AI models become larger, the amount of data and KV cache capacity that need to be processed during inference continue to increase; to improve AI system performance, not only memory bandwidth but also capacity expansion and data storage management technology have become crucial." To this end, he presented a technology strategy in three directions: speed, memory scalability, and data persistence.
Samsung Electronics also stated that the company is moving beyond individual memory product performance improvements to optimize the entire AI system, including central processing units (CPUs), graphics processing units (GPUs), memory, and storage, expanding co-design and technology verification cooperation with global customers and partners from the early stages of development. At this OCP event, Samsung jointly demonstrated a CXL-based memory expansion solution with AMD, unveiling technology cooperation achievements for flexibly expanding AI system memory capacity.
Samsung Electronics Commits to Enhancing AI Infrastructure Performance
The goal is to use CXL technology to overcome existing system memory capacity limitations amid increasing data processing volumes and memory demand during inference due to the proliferation of AI agents. In particular, Samsung showcased memory pooling technology based on CXL Memory Module DRAM (CMM-D), which can efficiently utilize memory resources across multiple systems to flexibly secure the memory capacity required for AI environments.
Samsung Electronics stated: "This joint demonstration holds significant meaning as it validates technology with global computing platform companies in a real system environment and expands cooperation to improve AI infrastructure performance." In addition, Samsung operated two exhibition zones at this event. In the "Tokenized Solution" zone introducing high-performance AI memory technology, it displayed HBM4E, HBM5, customized HBM, LPDDR5X-PIM, as well as 2-nanometer gate-all-around (GAA) process wafers, Groq LPU wafers, and the Nvidia Groq 3 LPX system.
In the "KV Cache Solution" zone, it introduced solutions for efficiently storing and managing the massive data generated during AI inference through CXL memory, enterprise SSDs, and KV cache optimization technology.
Samsung Electronics also strengthened co-design and technology verification cooperation with global customers. The company verifies next-generation memory and storage technologies in real AI environments through the "Samsung MAX Lab" and reflects customer requirements from the early stages of product development. At the same time, centered on the Global Open Ecosystem Taskforce (GOST), it participates in open-source software development and standardization activities, expanding the scope of cooperation from hardware to software optimization.
Samsung Electronics this year successively unveiled next-generation memory technologies such as HBM5 and zHBM at major global events including Nvidia GTC, Computex, and FMS, striving to strengthen AI semiconductor competitiveness. According to data from market research firm Counterpoint Research, Samsung Electronics ranked first with a 39% share of the global DRAM market by revenue in the second and fourth quarters of this year; during the same period, it also maintained first place in the NAND flash market with a 29.3% share. Samsung Electronics stated: "Based on technological prowess and production infrastructure, we will strengthen our offensive in high-value-added AI memory markets such as HBM, server DDR5, and enterprise SSDs.
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Item Specification Memory Type HBM5, Customized HBM, LPDDR5X-PIM Storage Technology CXL-based Memory Expansion Technology Solid-State Drive Technology Next-Generation SSD
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