- The USFP module co-developed by NVIDIA and Cisco delivers 12.8 Tbps bandwidth.
- The module is designed for large-scale computing facilities to support AI model operations.
- The USFP module employs new technology to improve power efficiency and signal quality.
- The two companies plan to establish an open industry specification to foster multi-vendor collaboration.
NVIDIA and Cisco announced plans to launch a new optical module capable of delivering up to 12.8 terabits per second (Tbps) of capacity, with four times the bandwidth density of existing 200-gigabit-per-second-per-channel technology. The module, called the Ultra-Dense Small Form Factor Pluggable (USFP), is designed to support 400-gigabit-per-second (Gbps) electrical signaling per channel. The two companies said the module's power efficiency can be approximately 30% higher than current 200-Gbps-per-channel pluggable modules.
New Technology Targeting AI
The technology primarily targets large-scale computing facilities that need to train and run artificial intelligence models. These systems require thousands of processors to exchange massive amounts of data, placing growing demands on the networks that connect them.
NVIDIA and Cisco are co-developing the USFP with connector manufacturers TE Connectivity and Amphenol, planning to establish a common hardware standard that would allow multiple vendors to produce compatible modules. They have not announced a commercial launch date.
Increasing channel count can enhance bandwidth. The first planned USFP transceivers will combine 16 full-duplex channels in a module roughly the same size as existing eight-channel Octal Small Form Factor Pluggable (OSFP) transceivers. Full-duplex means each channel can send and receive data simultaneously. By increasing the number of channels and the bandwidth per channel, the design aims to deliver four times the bandwidth density of existing 200-Gbps-per-channel modules. This will enable operators to connect more compute systems through existing switching infrastructure without adding extra network layers.
Module Design and Performance
Additional switches and optical links can increase latency, power consumption, and operating costs. The two companies said the USFP can support 1.6-Tbps network endpoints while scaling the overall architecture to 12.8 Tbps. Future versions may expand to 32 full-duplex channels or more. A key engineering change is the adoption of a two-dimensional connector array and a two-step insertion mechanism. Its high-speed electrical contacts engage only after the module is inserted, helping to reduce contact wear and maintain signal quality. The connector is also designed to improve electrical performance at the existing 200-Gbps-per-channel speed.
The USFP is designed to dissipate up to 100 watts of power without requiring separate cooling circuits, which could simplify switch construction while handling the heat generated by higher-bandwidth optical links. The architecture also supports optical designs that simplify signal processing, potentially reducing power consumption and communication latency. NVIDIA Senior Vice President Gilad Shainer said: "Building the world's largest AI factories starts with rethinking the smallest connections."
Advantages of Modular Design
The two companies intend to retain the hot-swappable modular design of existing optical transceivers, allowing operators to upgrade network hardware without fundamentally changing how equipment is installed or maintained. The collaboration builds on NVIDIA's Spectrum-X Ethernet networking technology and Cisco's Silicon One networking systems, which the two companies have been working to integrate. TE Connectivity and Amphenol will participate in the development of USFP connectors, cages, and modules, with more manufacturers expected to join.
NVIDIA and Cisco also plan to establish an open industry specification through a community-driven multi-source project. For now, the announced bandwidth and efficiency gains remain design targets, and the two companies have not disclosed independent test results, production volumes, or pricing for the planned modules.
USFP Module Drives Data Center Innovation
The USFP module from NVIDIA and Cisco marks a significant advance in data center technology. As demand for AI computing grows, the module not only boosts bandwidth density but also improves power efficiency, which is significant for operators looking to expand network capabilities without increasing infrastructure costs. The module's design accounts for compatibility with existing equipment, which will allow operators to upgrade their systems more easily, thereby accelerating data center modernization.